3D-MID Design and Manufacturing


Manuel Martin, Product Manager 3D-MID, Beta LAYOUT

Since electronic devices are becoming smaller and more precise engineers face the added challenge to develop devices which need less space and are lower in weight. The new 3D-MID (Mechatronic Integrated Devices) technology; plastic parts designed with electronic circuits, is a favorable solution and the answer to the requirements of the electronic industry for space saving modules. Three-dimensional circuit carriers enable engineers to develop multifunctional products with new features and reduced weight. 3D-MIDs are usually produced from injection molded plastic. A new method by using 3D prints instead of molds allows to produce MID-prototypes more economically and in less time.


  1. How 3D-MID prototypes based on laser sintered 3D prints are manufactured and explains how this technology will be accessible to a broad range of R&D engineers.
  2. The presentation will answer questions regarding the necessary data required for production, design rule specifications and manufacturing processes.